AMD Opteron 6376 - OS6376WKTGGHK / OS6376WKTGGHKWOF information

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Type:CPU	Manufacturer:AMD
family:Bulldozer	microprocessors:Opteron 6300 series

Type	CPU / Microprocessor
Market segment	Server
Family	AMD Opteron 6300 series
Model number	6376
CPU part numbers	OS6376WKTGGHK is an OEM/tray microprocessor OS6376WKTGGHKWOF is a boxed processor without fan and heatsink
Frequency	2300 MHz
Turbo frequency	2600 MHz (more than 8 cores) 3200 MHz (8 cores or less)
Bus speed	3200 MHz HyperTransport links (6.4 GT/s per link)
Package	1944-land organic Land Grid Array (LGA)
Socket	Socket G34
Introduction date	November 5, 2012
Price at introduction	$703
Architecture / Microarchitecture
Microarchitecture	Piledriver
Platform	Maranello
Processor core	Abu Dhabi
Core stepping	OR-C0
Manufacturing process	0.032 micron silicon-on-insulator (SOI) technology
Die size	316mm²
Data width	64 bit
The number of cores	16
The number of threads	16
Floating Point Unit	Integrated (shared between two cores in each module)
Level 1 cache size	8 x 64 KB shared instruction caches 16 x 16 KB data caches
Level 2 cache size	8 x 2 MB shared exclusive caches
Level 3 cache size	2 x 8 MB shared caches
Physical memory	384 GB (per socket) ^[1]
Multiprocessing	Up to 4 processors
Features	MMX instructions SSE / Streaming SIMD Extensions SSE2 / Streaming SIMD Extensions 2 SSE3 / Streaming SIMD Extensions 3 SSSE3 / Supplemental Streaming SIMD Extensions 3 SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4 SSE4a AES / Advanced Encryption Standard instructions AVX / Advanced Vector Extensions BMI1 / Bit Manipulation instructions 1 F16C / 16-bit Floating-Point conversion instructions FMA3 / 3-operand Fused Multiply-Add instructions FMA4 / 4-operand Fused Multiply-Add instructions TBM / Trailing Bit Manipulation instructions XOP / eXtended Operations instructions AMD64 / AMD 64-bit technology AMD-V 2.0 / AMD Virtualization technology 2.0 EVP / Enhanced Virus Protection Turbo Core 2.0 technology
Low power features	AMD-P 2.0: C6 state TDP power cap
Integrated peripherals / components
Integrated graphics	None
Memory controller	The number of controllers: 1 Memory channels: 4 Supported memory: UDDR3-1600, RDDR3-1600, ULV RDDR3-1333, LRDIMM-1333 DIMMs per channel: 3 Maximum memory bandwidth (GB/s): 51.2
Other peripherals	HyperTransport 3.0 technology with 4 HT links
Electrical / Thermal parameters
Maximum operating temperature	69°C
Thermal Design Power	115 Watt
Notes on AMD Opteron 6376
Die size is per die. The package houses two dies [1] - Information is not confirmed

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